IBM and 3M have come up with an adhesive that will allow them to stack up to 100 semiconductors onto a single microchip. Larry Greenemeier reports

据Larry Greenemeier报道，IBM和3M联合研制了一种特殊的“胶水”，可以在一块芯片上可以层叠100层半导元件。

Makers of the microchips found in smartphones, tablets and other gadgets are figuring out something that urban planners learned a long time ago—when you can no longer build out, you need to build up.

芯片制造商发现在智能手机、平板电脑以及其他电子设备迅速发展的今天，已经没有扩展空间给芯片升级了，而只能设法在有限的空间“向上”发展了，正如城市规划者早已实施的那样。

Stacked integrated circuits are today's tech skyscrapers. They're vital as consumer electronics makers look to cram more processing power and memory into smaller devices. But just like any other skyscraper, these 3-D chips have to keep the power flowing from layer to layer without overheating.

层叠式集成电路正是今天科技的摩天大楼。当电子设备制造商希望能更小的设备里实现更快的计算能力和更大的内存时，层叠式集成电路的发展前景越来越有活力。但正如其他摩天大楼一样，3-D芯片需要保证各层之间的能量保证，但又需避免发热量过大。

IBM and 3M recently announced that they have a cool solution: a unique adhesive for packing the chip's layers. This adhesive can efficiently conduct heat through the densely packed layers of semiconductors inside these chips. This packaging should also keep heat away from sensitive components like logic circuits.

IBM和3M最近宣布他们发明了一种全新的解决方案，利用独创的黏合剂将芯片层粘在一起。这种黏合剂可以有效的保证层叠式集成电路上的每一个结合紧密的半导体层之间能够快速的传导热量，同时这种层叠技术可以保证如逻辑电路等敏感组件不至于过热。

The companies say their new adhesive will be able to tightly stack up to 100 logic, networking and memory semiconductors into a single chip. Which could deliver processing speeds of up to one-thousand times faster than today—and turn your next iPhone from a four-story walk-up to a luxury high-rise.

两家公司宣布，他们创新的黏合剂可以紧密的粘合100层逻辑、网络以及内存半导体部件在一块芯片上，这将使芯片的运算速度提升1000倍，将来iPhone将从现在没有电梯的四层小楼跃升为一座豪华的摩天大楼。
—Larry Greenemeier